PVP Technology Co., Ltd.

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PCB Manufacturer Services

PCB Manufacturer Services

At PVP-TECHNOLOGY, standard PCB service refers to full-featured printed circuit board manufacturing services. With more than ten years of PCB manufacturing experience, we have handled hundreds of thousands of PCB projects, covering almost all types of substrate materials, including FR4, aluminum, Rogers, etc. Serving the fields of consumer electronics/automotive electronics/medical equipment/communications.

The following is a systematic classification and detailed introduction of PCB (printed circuit board) types, covering common types, characteristics and application scenarios:

1. Classification by Layer Count

Type	Structure	Key Features	Applications
Single-Sided	Conductive layer on one side	Lowest cost, simple design	Calculators, LED lights
Double-Sided	Conductive layers on both sides	Via connections, moderate density	Automotive dashboards, IoT devices
Multilayer	4-30+ layers with inner planes	High-speed routing, EMI shielding	Servers, medical imaging systems
HDI	Microvias (<0.1mm), stacked vias	Ultra-high density, miniaturization	Smartphones, wearable devices

2. Classification by Substrate Material

Type	Material Composition	Properties	Ideal Use Cases
FR-4	Fiberglass + epoxy resin	Cost-effective, UL94 V-0 rated	General electronics
Metal Core	Aluminum base + dielectric	Superior heat dissipation (1-3W/mK)	LED lighting, power modules
Ceramic	Alumina/Aluminum nitride	High-temp resistant (>800°C), RF performance	Aerospace, RF power amplifiers
Flexible (FPC)	Polyimide film	Bendable, lightweight	Foldable phones, camera modules
Rigid-Flex	Hybrid rigid-flex design	3D assembly, space-saving	Medical endoscopes, drones

3. Specialty PCB Technologies

Type	Technical Features	Advantages	Application Examples
High-Frequency	Rogers/Teflon materials	Low dielectric loss (Dk<3.0)	Radar, satellite communication
Heavy Copper	≥3oz (105μm) copper thickness	High current capacity (50A+)	EV charging stations
Impedance Control	Precise trace/width control	Signal integrity (±10% tolerance)	High-speed servers, PCIe interfaces
Embedded Passive	Built-in R/C components	Space-saving, enhanced reliability	Miniature medical devices

4. Surface Finish Options

Finish Type	Thickness	Pros	Cons
ENIG	Ni 3-6μm / Au 0.05-0.1μm	Flat surface, wire-bondable	Higher cost
OSP	0.2-0.5μm	Eco-friendly, low cost	Short shelf life
Immersion Silver	0.1-0.3μm	Excellent for high-speed signals	Tarnishes over time
ENEPIG	Ni/Pd/Au layers	Gold wire & aluminum wire bonding	Most expensive